PillarHall® – accelerating thin film R&D

“What you can’t measure, you can’t improve.”

PillarHall® silicon wafers and chips enable easy analysis of thin film conformality using well-defined, record-demanding microscopic 3-D structures. Typical usage areas are atomic layer deposition and chemical vapor deposition R&D.


Scientific articles (newest first) created with PillarHall® microscopic lateral high-aspect-ratio (LHAR) test structures:
1. Nucleation and Conformality of Iridium and Iridium Oxide Thin Films Grown by Atomic Layer Deposition
M. Mattinen, J. Hämäläinen, F. Gao, P. Jalkanen, K. Mizohata, J. Räisänen, R. L. Puurunen, M. Ritala, M. Leskelä, Langmuir 32 (2016) 10559-10569.
2.  Microscopic silicon-based lateral high-aspect-ratio structures for thin film conformality analysis
F. Gao, S. Arpiainen, R. L. Puurunen, J. Vac. Sci. Technol. A (letter) 33 (2015) 010601 (5 pages).
http://dx.doi.org/10.1116/1.4903941, open access [PDF].
Dr. Mikko Utriainen

VTT Technical Research Centre of Finland Ltd

mikko.utriainen (at) vtt.fi

Tel: +358 40 753 7415

Twitter: #TestedWithPillarHall