PillarHall^® – accelerating thin film R&D

“What you can’t measure, you can’t improve.”

PillarHall^® Test Chips enable easy, fast and accurate way to characterize thin film processes in 3-D substrate. Typical use is conformality measurements in atomic layer deposition and chemical vapor deposition R&D.

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Applications

• ALD and CVD process development
• Precursor and new process R&D
• Atomic layer etching (ALE) development
• Engineering processes for certain high aspect ratio 3D device structures
• Kinetic modelling of ALD, CVD and ALE
• Process quality control and assurance

Benefits

• Customer-neutral and accessible test structures
• Save time and costs using conventional surface analysis tools instead of electron microscopy cross-sections
• Record-high aspect ratios (10 000:1) to quantify figure-of-merits for conformality
• Submicrometer limiting dimensions define the molecular flow regime relevant for modelling
• Accurate and reliable information for quality assurance and fundamental process characterization
• Wide compatibility to various conditions (temperature, pressure, IC cleanliness)

PillarHall® Test Chips are fabricated and made available by VTT Technical Research Center of Finland Ltd, Micronova Nanofabrication Center

Links

PillarHall – introduction in SlideShare

PillarHall – introduction in YouTube

Video: How to use PillarHall test chip

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Contact us

Dr. Mikko Utriainen
VTT Technical Research Centre of Finland Ltd
Tel. +358 40 753 7415
mikko.utriainen(at)vtt.fi

pillarhall(at)vtt.fi

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