PillarHall® – Lateral High Aspect Ratio Test Structures
PillarHall® test chips enable easy, fast and accurate way to characterize thin film processes and to solve Ultra High Aspect Ratio nanometrology challenges. Typical use is thin film conformality measurements in
atomic layer deposition and
chemical vapor deposition processes.
Applications
ALD and CVD process development
Precursor and new process R&D
Atomic layer etching (ALE) development
Engineering processes for certain high aspect ratio 3D device structures
Kinetic modelling of ALD, CVD and ALE
Process quality control and assurance
Benefits
Customer-neutral and accessible test structures
Save time and costs using conventional surface analysis tools instead of electron microscopy cross-sections
Record-high aspect ratios (10 000:1) to quantify figure-of-merits for conformality
Submicrometer limiting dimensions define the molecular flow regime relevant for modelling
Accurate and reliable information for quality assurance and fundamental process characterization
Wide compatibility to various conditions (temperature, pressure, IC cleanliness)
PillarHall ® Test Chips product sales are carried out by
Chipmetrics Ltd. Country of origin is Finland.
