PillarHall^® – accelerating thin film R&D

“What you can’t measure, you can’t improve.”

PillarHall^® silicon wafers and chips enable easy analysis of thin film conformality using well-defined, record-demanding microscopic 3-D structures. Typical usage areas are atomic layer deposition and chemical vapor deposition R&D.

PillarHall introduction in SlideShare.

We are searching for test users, business collaborators and partners.

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Applications

• ALD and CVD process development
• Precursor and new process R&D
• Atomic layer etching (ALE) development
• Engineering processes for certain high aspect ratio 3D device structures
• Kinetic modelling of ALD, CVD and ALE
• Process quality control and assurance

Benefits

• Customer-neutral and accessible test structures
• Save time and costs using conventional surface analysis tools instead of electron microscopy cross-sections
• Record-high aspect ratios (10 000:1) to quantify figure-of-merits for conformality
• Submicrometer limiting dimensions define the molecular flow regime relevant for modelling
• Accurate and reliable information for quality assurance and fundamental process characterization
• Wide compatibility to various conditions (temperature, pressure, IC cleanliness)

NEWS

Meet us at conferences in 2017. Read more...

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TAKE THE SURVEY and express your interest to test PillarHall.

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Contact us

Dr. Mikko Utriainen
VTT Technical Research Centre of Finland Ltd
Tel. +358 40 753 7415
mikko.utriainen(at)vtt.fi

pillarhall(at)vtt.fi

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  #TestedWithPillarHall