PillarHall^® – Lateral High Aspect Ratio Test Structures

PillarHall^® test chips enable easy, fast and accurate way to characterize thin film processes and to solve Ultra High Aspect Ratio nanometrology challenges. Typical use is thin film conformality measurements in atomic layer deposition and chemical vapor deposition processes.

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Applications

• ALD and CVD process development
• Precursor and new process R&D
• Atomic layer etching (ALE) development
• Engineering processes for certain high aspect ratio 3D device structures
• Kinetic modelling of ALD, CVD and ALE
• Process quality control and assurance

Benefits

• Customer-neutral and accessible test structures
• Save time and costs using conventional surface analysis tools instead of electron microscopy cross-sections
• Record-high aspect ratios (10 000:1) to quantify figure-of-merits for conformality
• Submicrometer limiting dimensions define the molecular flow regime relevant for modelling
• Accurate and reliable information for quality assurance and fundamental process characterization
• Wide compatibility to various conditions (temperature, pressure, IC cleanliness)

PillarHall® Test Chips are fabricated and made available by VTT Technical Research Center of Finland Ltd, Micronova Nanofabrication Center

Links

PillarHall – introduction in SlideShare

PillarHall – introduction in YouTube

Video: How to use PillarHall test chip

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Contact us

Dr. Mikko Utriainen
VTT Technical Research Centre of Finland Ltd
Tel. +358 40 753 7415
mikko.utriainen(at)vtt.fi

pillarhall(at)vtt.fi

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